KoldLok Integral - Model #1010

Applications

Installation in new or existing raised floor tiles prior to
the installation of racks or cabinets containing computer and communication equipment.

Features

Grommet is inherently self-sealing using a multilayer,
overlapping, and interwoven, bypass airflow closure system consisting of:

• Two opposing overlapping arrays of 0.010" diameter upper filaments
• Two opposing arrays of 0.020" diameter lower filaments
• <3,100 filaments per cross sectional inch

Grommet filaments are premium grade Nylon 6 ensuring bristle flexibility, compliance, and selfsealing recovery. Filaments are conductive with static dissipation properties.

Grommet and filaments safely bleed off any static build up on cables passing through the cable opening caused by high velocity airflow (triboelectric effect). Grommet is an integral part of the raised floor¹s static dissipation system providing 1 GigaOhm of resistance.

Grommet shall achieve 100% bypass airflow sealing in areas undisturbed by cable penetrations at static pressures up to 0.10 inches of water column. When penetrated by four 1/2" cables, sealing is 100% effective at the static pressure required to cool up to 3 kW/cabinet with a 96% sealing effectiveness at a static pressure of 0.10".

Grommet contains no loose or partially fastened parts, which can become separated, fall through the raised floor, tent, or be kicked out of position.

Grommet is a heavy duty, molded, high impact resistant polypropylene housing with a wide trim
lip to provide a bumper to inhibit equipment casters from falling through raised floor openings and to allow imprecise tile cutting.

Grommet metal components are anodized to resist corrosion caused by high humidity and are assembled with positive fasteners that will not pull through the plastic. Grommet is installed using four (4) provided self-drilling sheet metal screws without requiring predrilling.

Grommet satisfies NFPA 75 Section 5-4.4 requirement by self-dressing the raw metal edges of raised-floor tile cable cutouts.

Specifications

KoldLok is a permanent airflow sealing solution which will accept perpetual cabling¹ changes without requiring technician training, policing, or labor to cut, scribe, re-install, reposition, or modify any part of the grommet.

KoldLok is the best² low cost solution for achieving the hardware air intake temperature and humidity conditions required for maximum reliability and performance by computer and communication manufacturers.

The KoldLok system of overlapping, offset, multi-layer, interwoven bypass airflow closures utilizing KoldFilaments™ guarantees sealing effectiveness. (U.S. Patent No. 6,632,999.)

KoldLok avoids unnecessary investments in additional cooling capacity* by reducing bypass
airflow which increases both the effectiveness and usable capacity of existing cooling equipment.

KoldLok's 32 square inch usable cable area is sufficient to accommodate virtually all cabling requirements (typical cable fill area is less than 5 square inches, after plug has passed through).

KoldLok's sealing effectiveness enables standardization on one size of tile cutout reducing cost and tile inventory.

¹ It is estimated that, on average, 25% of all raised floor openings are re-cabled quarterly.

² Filaments are premium grade Nylon 6. Filaments made of styrene, ABS or polypropolene fall below KoldLok product standards.

*For a typical 10,000ft2 computer room with 170 cable openings, preventing the 49,000 cubic feet per minute bypass airflow loss through unsealed cable cutouts is equivalent to recovering the
output from five or more 20-Ton cooling units.

Installation

DIMENSIONS & TILE CUTTING SPECIFICATIONS

Overall size: 11" x 8 1/4" x 1 5/8"
Grommet usable cable opening size: 8" x 4"*
Grommet total cable opening size: 8" x 5"

*Ensures easy passage of cable heads and power connectors including a 100 amp Hubbell™ power plug (or equivalent 4.125" x 4.125" connector).

Background

ELIMINATE BYPASS AIRFLOW
Unsealed cable openings allow 63% or more of bypass air losses in a typical computer room. Excessive bypass airflow will reduce underfloor static pressure to as low as 0.01" of water column. This is much lower than the 0.025" required for cooling high heat densities (> 1 kW/rack or cabinet). Unmanaged bypass air results in vertical and zone hot spots and introduces significant cooling inefficiencies.

A CLEAR SOLUTION
The KoldLok Integral Raised-Floor Grommet automatically reseals raised-floor openings, permanently solving bypass airflow problems.

KoldLok Integral - Model #1010 Installation